Asetek

Premium Thermal AIO Solution, Acoustically Optimized
Asetek Emma V3 [Gen10] is engineered specifically for next-generation processors. It delivers lower core thermal resistance and enhanced installation flexibility, all within an ultra-quiet acoustic profile.

4mm Combined Offset: Precision Alignment with Core Hotspots
Compared to the previous generation, thermal resistance is reduced by an additional 1.5°C at typical TDP, optimizing heat transfer efficiency right at the source. This architecture is specifically tailored to tackle localized hot spots on the latest high-performance CPUs, such as the AMD Ryzen™ 9950X.

．Dual-Offset Design: Building upon the bracket offset concept from Emma V2, the Emma V3 further shifts the cold plate’s center groove closer to the heat source. Together, they achieve a combined offset of 4mm. Determined through extensive thermal simulations and real-world testing, this configuration ensures the coolant’s primary impingement zone directly covers the core hotspots.
．Optimized Convex Curvature: The copper cold plate features a redesigned convex curvature tailored to match the subtle surface curvature of next-gen CPU integrated heat spreaders (IHS). This maximizes the contact area with critical hot spots while remaining strictly within official mounting pressure specifications.
．High-Density Micro-Channels: Engineered with a high-density fin structure and paired with a high-efficiency hydraulic loop to significantly accelerate transient heat transfer.

Best-in-Class Balance of Performance and Acoustics
Controlling noise while elevating hydraulic efficiency remains a core challenge in liquid cooling engineering. The Emma V3 utilizes a high-head Closed Impeller architecture, achieving substantial acoustic improvements without sacrificing hydraulic performance.

．Operating at a full speed of 3,600 RPM (measured at a standard 25cm distance), the Emma V3 typically delivers up to 6 dB(A) lower acoustic levels compared to Emma V2 reference measurements. This reduction compared to its predecessor represents a massive drop in acoustic energy:
．Acoustic energy is reduced by approximately 4x, drastically minimizing the energy translated into system vibrations.
．Perceived loudness is cut by roughly 45%, transforming the pump’s acoustic profile from a noticeable hum into near-silent running.

Key enhancements of the Asetek Emma V3 include:

．7-Blade Impeller: Utilizing an odd number of blades disrupts the acoustic phase alignment common in even-blade configurations within the pump cavity, effectively dispersing fluid impact energy.
．Optimized Tongue Clearance: Slightly increasing the gap between the outer diameter of the impeller and the stator housing tongue allows for a smoother fluid transition, minimizing impact noise.
．Relocated Injection Gate: Moving the manufacturing injection molding gate to the back of the impeller eliminates minor geometric tolerances that could cause unintended fluid disturbances.
．Monolithic Stator Housing: Integrating a multi-piece structure into a single component removes part-to-part joints, cutting off vibration propagation paths at the source.

Decoupled Alignment and Fluid Routing: Flexing True Thermal Potential
With AMD and Intel adopting vastly different architectural layouts for their latest processors—and with PC builders constantly pushing the envelope of chassis aesthetics—the directional alignment of the cold plate has become critical. For instance, the primary hotspot on the AMD Ryzen 9950X is positioned toward the lower edge (6 o’clock), while Intel platforms locate theirs toward the upper edge (12 o’clock).

．The Emma V3 introduces a new rotatable bracket design, completely decoupling the traditional fixed relationship between the tube outlets and the internal micro-channel orientation:
．Enhanced Factory Integration: This design allows the tube outlet orientation and the internal cold plate alignment to be configured independently during factory assembly. Based on specific system layouts or customer requirements, the tube routing can be optimized freely without compromising the precise targeting of platform-specific CPU hotspots (e.g., 6 o’clock for AMD, 12 o’clock for Intel).
．Streamlined SKU Management: A single pump architecture delivers optimal thermal performance across both major platforms, significantly enhancing product line planning flexibility and reducing SKU complexity for OEM and ODM partners.

(Optional Component for High-Load Environments)

Cross-flow Heat Exchanger (CCF Radiator): Designed for the extreme requirements of workstations and flagship gaming rigs, the optional CCF radiator optimizes heat exchange efficiency via perpendicular fluid and airflow directions. This configuration provides an additional 0.3 to 0.5°C temperature reduction over standard radiators.

Sustainability & Green Engineering
．Eco-Friendly, Rare-Earth-Free Pump Design: The electromagnetic drive system utilizes premium inert, corrosion-resistant magnets, completely eliminating the need for rare-earth elements. This significantly enhances long-term material stability while advancing global product sustainability.

．Food-Grade, Non-Toxic Patented Coolant: The internal coolant is engineered from eco-friendly, non-toxic materials that meet food-grade safety standards. It is completely safe to handle and can be disposed of through standard household wastewater systems. The formulation complies with the world’s most stringent environmental and chemical standards, carrying full certifications for RoHS, REACH, California Prop 65, and Halogen-Free compliance.

Quality Assurance & Engineering Excellence
．Rigorous Manufacturing & Validated Packaging: Every single radiator undergoes a comprehensive high-temperature flush and cleaning cycle during assembly, with full traceability implemented across the entire production process. Prior to mass production, the deployment packaging undergoes rigorous reliability validation via CNAS-certified stress testing, ensuring the product remains perfectly secure and leak-free against extreme temperature fluctuations and pressure shifts during global transit.
．50,000-Hour Uncompromised Operational Lifespan: Engineered with an ultra-low fluid evaporation rate and an advanced anti-clogging, anti-freeze, and anti-corrosion formula, the platform guarantees at least 50,000 hours of peak operational life. Thermal dissipation efficiency remains uncompromised and will not degrade over years of sustained operation. Furthermore, the platform is fully verified under IEC 62368-1 and UL 62368-1 international safety standards, delivering the ultimate peace of mind and long-term reliability for end-users.

The All-In-One Liquid Cooling Platform for Elite Acoustics and Reliable Thermal Performance

Under identical testing parameters, the Ingrid Mainstream [Gen9] sits within a striking distance of our flagship Emma V2 [Gen8] with a 3°C variance, while delivering a more cost-effective and whisper-quiet operation. Whether for professional creators requiring absolute focus or PC gamers active at night, the Ingrid Mainstream [Gen9] is the ideal synergy of high thermal performance and exceptional value.

(Test Scenario: Intel Core Ultra 9 285K processor, CPU temperature comparison under a 300W thermal load at 22°C ambient temperature)

Structural Reorganization & Precision Acoustic Control

．Patent-Pending Pump and Impeller Assembly: At the core of Ingrid Mainstream [Gen9] is a newly engineered pump and impeller assembly, molded using a patent-pending new technology. This manufacturing breakthrough delivers significantly improved balance and reduced vibration, effectively eradicating coil whine and high-pitched resonance at the component level to maintain a safe official acoustic claim of 18-20 dB(A).
．Monolithic Stator Housing Design: The platform addresses acoustic performance through effective structural reorganization rather than relying on complex external dampening materials. By integrating the stator directly into a high-rigidity Monolithic Stator Housing profile that anchors rigidly onto the copper coldplate, the physical mass and structural stiffness of the pump are significantly increased. This direct mechanical coupling suppresses micro-vibrations and shifts operational resonance away from human-sensitive frequencies, minimizing system-wide resonance even when installed directly onto the motherboard.
．Acoustic Standards Verification: Engineered specifically for noise-sensitive gaming systems, professional workstations, and enterprise hardware, the platform is fully verified to meet strict ISO 3744 / ISO 3745 international noise testing standards, guaranteeing a low-noise user experience in real-world environments.

Cold Plate Efficiency & Thermal Management

．Next-Gen CPU Architecture Ready: Grounded in practical engineering and decades of thermal leadership, Asetek engineers work closely with silicon leaders like Intel and AMD to optimize internal thermal paths. The copper coldplate micro-channels are re-engineered to provide efficient thermal paths directly over primary CPU hot-spots, ensuring thermal stability under extreme overclocking loads of at least 400W.
．Low-Thermal-Resistance Copper Coldplate: Under aggressive high-wattage workloads, the internal layout of the coldplate micro-channels dictates the ultimate thermal ceiling. While fully complying with silicon partner Clamp Force testing standards to prevent mechanical warping under modern socket pressure, the micro-channel layout is optimized to shorten thermal paths and minimize resistance over primary CPU hot-spots.
．Smart Thermal Sensing Telemetry: The cooling block integrates an onboard liquid temperature sensor to monitor the actual thermal capacity of the coolant. If coolant temperatures rise above target, the system intelligently increases pump speed to compensate, dampening erratic, noisy fan ramp-ups caused by sudden CPU spikes. The real-time coolant temperature data can also be output to digital monitoring tools for enthusiast-grade telemetry and hardware integrations.

Integrated Retention & B2B Layout Flexibility

．Integrated Retention System: To optimize deployment, Asetek has condensed complex multi-step mounting mechanisms into an integrated retention system. With the mounting hardware pre-attached directly to the pump head, users can expect a streamlined 3-step installation process that significantly improves out-of-the-box usability.
．Silicon Partner Clamp Force Verification: Excessive mechanical pressure can inflict permanent damage on premium processors. Asetek’s coldplate is verified against Intel and AMD Clamp Force testing standards, ensuring optimal thermal contact while protecting the physical integrity of the CPU substrate under socket pressure.
．Modular B2B Layout Autonomy: Because Intel and AMD desktop architectures place their primary thermal zones differently, fixed fluid routing introduces performance trade-offs for integrators. The Ingrid Mainstream [Gen9] resolves this by offering OEM and System Integrator partners exclusive 3, 6, 9, and 12 o’clock fluid inlet rotations. Partners can independently configure tube orientations during factory assembly to fit custom chassis spaces while ensuring fluid dynamics remain practically optimized for specific platform layouts.

Sustainability & Green Engineering

．Eco-Friendly, Rare-Earth-Free Pump Design: The electromagnetic drive system utilizes premium inert, corrosion-resistant magnets, completely eliminating the need for rare-earth elements. This significantly enhances long-term material stability while advancing global product sustainability.
．Food-Grade, Non-Toxic Patented Coolant: The internal coolant is engineered from eco-friendly, non-toxic materials that meet food-grade safety standards. It is completely safe to handle and can be disposed of through standard household wastewater systems. The formulation complies with the world’s most stringent environmental and chemical standards, carrying full certifications for RoHS, REACH, California Prop 65, and Halogen-Free compliance.

Quality Assurance & Engineering Excellence

．Rigorous Manufacturing & Validated Packaging: Every single radiator undergoes a comprehensive high-temperature flush and cleaning cycle during assembly, with full traceability implemented across the entire production process. Prior to mass production, the deployment packaging undergoes rigorous reliability validation via CNAS-certified stress testing, ensuring the product remains perfectly secure and leak-free against extreme temperature fluctuations and pressure shifts during global transit.
．50,000-Hour Uncompromised Operational Lifespan: Engineered with an ultra-low fluid evaporation rate and an advanced anti-clogging, anti-freeze, and anti-corrosion formula, the platform guarantees at least 50,000 hours of peak operational life. Thermal dissipation efficiency remains uncompromised and will not degrade over years of sustained operation. Furthermore, the platform is fully verified under IEC 62368-1 and UL 62368-1 international safety standards, delivering the ultimate peace of mind and long-term reliability for end-users.

Asetek Unveils Ingrid – A New Liquid Cooling Platform Delivering Silent Performance, Customization, and Scalable Innovation 

Aalborg, Denmark – May 2025 – Asetek, the pioneer of the all-in-one (AIO) liquid cooler and global leader in mechatronic innovation, today announced the launch of Ingrid — a new platform-based liquid cooling solution engineered to deliver superior thermal performance, reduced acoustic footprint, and platform-level flexibility for both partners and PC builders. The Ingrid product line debuts with Value and Mainstream offerings and will later expand the product family – powering a complete cooling portfolio built for tomorrow’s CPU architectures and the demands of AI workloads. 

Set to debut at Computex 2025, Ingrid represents a new generation of Asetek AIO design, built on decades of thermal leadership and precision engineering. 

“With Ingrid, we’re introducing a platform-based approach that meets the needs of B2B customers, OEM partners, and PC enthusiasts alike,” said André Sloth Eriksen, CEO and Founder of Asetek. “It’s our most refined acoustic and installation experience to date — and a foundation we’ll continue to expand.” 

Asetek Delivers All-In-One Liquid Cooler to Support High Wattage Processors for Extreme Workstations
Asetek 690LX-PN Liquid Cooler Approved for the Intel® Xeon® W-3175X Processor; Supports Overclocked CPUs up to 500W
Asetek Delivers All-In-One Liquid Cooler to Support High Wattage Processors for Extreme Workstations

SAN JOSE, Calif. – January 30, 2019 – Asetek, the creator of the all-in-one liquid cooler and the global leader in liquid cooling solutions for gaming PCs and DIY enthusiasts, announced the availability of its highest performance all-in-one (AIO) liquid cooler to date, designed in collaboration with Intel®. The Asetek 690LX-PN liquid cooler is approved for the Intel® Xeon® W-3175X processor. The all new Asetek 690LX-PN liquid cooler features extreme performance to enable overclocking up to 500 watts (W) and provides stable operation for demanding workstation and content creation workloads. Together, the 690LX-PN liquid cooler and Intel® Xeon® W-3175X processor provide the ultimate experience for professional content creators, CAD artists and game developers.

The Asetek 690LX-PN 360mm AIO liquid cooler utilizes the new Gen6-s pump from Asetek – the same core technology that is used to cool some of the world’s fastest supercomputers and includes a highly efficient copper radiator. The larger cold plate covers the entire CPU package and ensures optimal thermal contact between the CPU and cold plate. The Asetek 690LX-PN liquid cooler is approved to cool the new 28-core/56 thread Intel Xeon W-3175X processor, which offers up to 4.3 GHz single-core turbo frequency and was built with real-world single and multi-thread performance in mind for demanding, compute intensive workloads. The Intel Xeon® W-3175X processor is unlocked for those who want to push performance even higher, with extensive heat dissipation from the Asetek 690LX-PN.

“We are thrilled that Intel chose to collaborate with Asetek to cool its new Intel Xeon® W-3175X processor,” said John Hamill, Chief Operating Officer at Asetek. “Innovation like this is right in our wheelhouse. We relished the challenge of designing a cooler with Intel that delivers extreme performance for some of the most intense processing and overclocking challenges.”

“When designing the Intel Xeon W-3175X processor, we knew liquid cooling would be required for overclocking and to unleash its performance for compute-intensive applications,” said Brandt Guttridge, General Manager, Desktop Product Marketing at Intel. “We’ve partnered closely with Asetek for many years and are excited to take advantage of their experience and expertise in chip cooling to design and offer a liquid cooler that enables incredible real-world performance.”

Built from the ground up to cool the most advanced CPUs, the Asetek 690LX-PN comes fully assembled, is factory filled and sealed, and never needs refilling. It includes an extreme performance pump and cold plate, three 120mm fans pre-mounted for simple installation, and a highly efficient 360mm copper radiator.

To purchase the 690LX-PN 360mm AIO liquid cooler, please visit store.asetek.com. For more information on Asetek, please visit www.asetek.com.

About Asetek
Asetek is the global leader in liquid cooling solutions for data centers, servers and PCs. Founded in 2000, Asetek is headquartered in Denmark and has operations in the United States, UK, Germany, China and Taiwan. Asetek is listed on the Oslo Stock Exchange (ASETEK.OL).

Intel, Intel Core, Xeon and the Intel logo are trademarks of Intel Corporation or its subsidiaries in the U.S. and/or other countries.